OPUS Microsystems, with 17 years R&D experience of MEMS technology and more than 30 invention patents, develops its 3D depth cameras & MEMS LiDAR in the depth sensing industry, and AR head-up displays in the field of micro projection. We are able to provide not only the chip, module, but also the overall solutions, applied to 3D face recognition with high resolution, industrial automation, robotics, AGV, AR&VR applications to empower 3D vision for AI.