3D near memory structure for AI computing

Artificial intelligence requires high computing power and fast access of memory IC. The 3D Interchip stacking method which integrates logic chips and memory chips provides a high-bandwidth channel between the processor and the memory. This can shorten data transmission distance, greatly improve AI computing performance, and reduce power consumption at the same time. PSMC is committed to the research and development and the promotion of AIM architecture. At present, several customers have adopted this architecture to enter into the field of high-performance computing.
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