Underfill

AS-3900 is a one-component epoxy based adhesive for CSP, BGA under-fill and corner-fill resin that is designed to provide curing ability at a temperature about 120ºC. This adhesive is cured by elevated temperatures and developed a strong bond enough to protect solder connections between IC package and PCB from vibration, bending force and drop impact and improve their reliability. Especially its cured resin's CTE is lower enough to provide more reliability.
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