MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset
Publish Date :2021/05/13
MediaTek announced the new Dimensity 900 5G chipset, the latest addition to
its Dimensity 5G family on May 13rd. The Dimensity 900 chipset, built on the 6nm
high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast
FHD+ 120Hz displays and a 108MP main camera for an all-around incredible
experience.
“Dimensity 900 brings a suite of connectivity, display and 4K HDR visual
enhancements to high-tier 5G smartphones and gives brands great design
flexibility for their 5G portfolios,” said Dr. JC Hsu, Corporate VP and GM of
MediaTek's Wireless Communications Business Unit. “The chipset’s support for 5G
and Wi-Fi 6 ensures users get the most of out their devices with super-fast and
reliable connectivity.”
The Dimensity 900 chipset is integrated with a 5G New Radio (NR) sub-6GHz
modem with carrier aggregation and support for bandwidth up to 120MHz. The
chipset is equipped with an octa-core central processing unit (CPU) consisting
of two Arm Cortex-A78 processors with a clock speed of up to 2.4GHz and six Arm
Cortex-A55 cores operating at up to 2GHz. Dimensity 900 supports flagship LPDDR5
memory and UFS 3.1 storage, and can adapt to a 120Hz screen refresh rate,
bringing excellent performance improvements and a seamless experience to 5G
mobile devices.
The chipset also integrates an Arm Mali-G68 MC4 graphics processing unit (GPU),
along with an independent artificial intelligence (AI) processing unit (APU)
that delivers optimal power efficiency for extended battery life. The 3rd
generation of MediaTek’s AI processing unit is extremely power-efficient to
support a wide variety of AI applications and 4K high definition resolution (HDR).
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