ASE, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC Join Forces to Standardize Chiplet Ecosystem

Picture sourced from Intel's Press Release: "Fostering a Chiplet Ecosystem for the Future of Moore’s Law"

Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

The organization, representing a diverse ecosystem of market segments, will address customer requests for more customizable package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multi-vendor ecosystem.

Full press release is available at the Universal Chiplet Interconnect Express website at https://www.uciexpress.org/news