Simcenter Thermal Test Solution
Simcenter T3STER
An advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices and multi-die devices. It measures the true thermal transient response more efficiently than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. The measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort.
Simcenter POWERTESTER
Provides the industry-unique capability of combining active power cycling with transient thermal characterization and thermal structure investigation. The non-destructive structure-function assessment is performed while the device remains mounted, providing a full electrical and structural assessment of the device throughout the testing program in a fully automated way.
Inquiry