Industrial high-performance solutions - 112-layer (BiCS5) Wide-Temperature 3D NAND Series and DDR5 Memory Modules
112-layer (BiCS5) Wide-Temperature 3D NAND Series
● Superior performance: featuring the latest PCIe Gen4x4 interface
● Compliant with NVMe 2.0/1.4 standard
● 112-layer 3D TLC NAND flash for higher capacities, efficiency, and durability
● Utilizes WDC and KIOXIA Original (OG) IC for great reliability
● Up to 4TB of capacity
● 3K P/E (Program/Erase) cycle rating for high endurance
● Supports LDPC ECC and SLC Cache technologies
● Supports AES 256-bit and TCG Opal 2.0 data encryption technology
● Available in various form factors for high compatibility, including 2.5”, M.2 2280, M.2 2242, mSATA SSDs, CFast cards, and microSD cards
● Suitable for IoT-related applications, HPC (high-performance computing), AI, automation, servers, data centers, networking, surveillance and transportation
DDR5 4800 Memory Modules
● Ultra-high speed of 4800 MT/s
● High capacities up to 32GB
● Power Management IC (PMIC) ensures power supply stability
● Ultra-low operating voltage of 1.1V for improved power efficiency
● On-die ECC technology for more reliable data transmission
● 30µ PCB gold plating for improved product durability and longevity
● Customized services: Anti-Sulfuration Protection and Conformal Coating help to enhance the product durability in harsh environments
● Ideal for edge computing, IoT, 5G, and industrial PC related applications
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