Semiconductor Intellectual Property
Egis’s IP products include Foundation IP, UCIe(D2D), ONFI, DDR, MIPI, Automotive IP Suite, Display Interface, and ADC. Among these, UCIe is the most popular product. We offer two types of UCIe controllers, both supporting Chiplets with different process node technologies, enabling chips produced using various manufacturing techniques to be integrated into the same system. Whether a 3/4/5nm CPU or a 10nm memory controller, UCIe offers flexibility that allows customers to choose the most suitable process, enhancing performance while reducing overall costs.
The UCIe-A solution features 8-channel PHY with 64Tx/64Rx lanes per channel and supports advanced packaging technologies such as CoWoSTM, INFOTM, and EMIBTM. On the other hand, the UCIe-S solution supports a wide range of process nodes, including 28nm, 22nm, 16nm, 12nm, 7nm, and 6nm, and allows MCM, BGA packages, and Chiplet-to-Chiplet interconnects on PCB.
Egis' UCIe solutions provide high-speed and low-latency data connectivity that significantly improves data flow efficiency between chips. This enables efficient connection of various Chiplets, including CPUs, AI accelerators, and I/O controllers. In the 5nm process, UCIe can provide bandwidth of up to 1.5TB/s, while in the more advanced 3nm node, it can reach 2TB/s. This not only enhances overall chip performance and manufacturing yield but also simplifies design complexity and reduces development time for data-intensive applications. As a result, Egis’s UCIe solutions are widely used in AI inference and high-performance computing fields.
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