Memory Modules Packaging
Designed specifically for vacuum forming and thermoforming trays (memory packaging) for precision instruments, electronic components, D-RAM memory, and IC components that require dust prevention. Widely used with customizable designs.
[Memory Packaging and Tray Design]
☑Stackable Trays
￭ Equipped with excellent transport and storage functions. ￭ Effectively utilizing vertical space to increase transport volume. ￭ Stackable empty boxes reduce cargo volume.
☑Secure Snap-On Lid
￭ The dustproof blister tray cover also has protective functions. ￭ A snap-on design on all four sides. Don't have to worry about the cover falling off.
☑Stackable Structure for Complete Packaging
￭ The top cover perfectly matches the button of the tray, allowing both surfaces to be placed smoothly.
☑Blister Tray Layout Design
￭ Carefully measured size of the stackable box, cover, and card slot.
￭ Quantity numbering and specification batch numbers can be engraved.
￭ Customized marking, auxiliary information, like serial number and date, can increase recognition and display your brand.
☑Other Packaging option
￭ External Packaging Boxes like:
Paper box, Cardboard Box, Retail Box Accessories.
￭ Environmentally Friendly Materials such as:
Recycled Pulp, rPET Low-Carbon Plastics, 100% Recyclable Plastics, etc.
For more possibilities, please contact us and have a comprehensive discussion with our specialized designers.
We can provide you with the most reassuring packaging development experience.
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