Single-layer DRAM-Tile WoW for CNN
PSMC revolutionizes AI accelerator IC that integrates AI computing logic chips and high-bandwidth DRAM using a 3D wafer-on-wafer (WoW) process. By using Near-Memory Computing, it overcomes the limitations of memory bandwidth and energy consumption encountered during AI deep learning. This demo chip AIM-200 includes the ITRI DLA AI Engine with 2048+64 MAC units using 40nm logic process, and the PSMC DRAM Block with 1Gb+128Mb DRAM capacity using 25nm DRAM process. Through TSV and Hybrid bonding, they are heterogeneously integrated into a 3D package, providing 16GB/s high-speed memory access and 1 TOP performance. With a memory access energy consumption of less than 0.2 pJ/bit and overall power consumption of less than 1W, the AIM-200 is suitable for AI image recognition applications on the Edge and Device。