Multi-layer DRAM WoW Cube for LLM/GAI
PSMC is the world's first company capable of integrating logic and memory technologies. As the data demand for generative AI continues to grow, it is expected that existing memory may not meet these needs in the next three years. Therefore, the development of 3D stacking technology becomes crucial. PSMC has developed a wafer-level system integration AI design and manufacturing service platform, which integrates 28-nanometer logic, 21-nanometer DRAM, and wafer stacking process technology, providing the following advantages: increased bandwidth, reduced latency, high performance, low power consumption, especially suitable for applications requiring large bandwidth such as AI, networking, and image processing.
PSMC has constructed an IP design service ecosystem, developed logic chips and DRAM vertical heterogeneous bonding processes, and jointly developed new DRAM architectures required for the next generation of AI applications. Through this breakthrough technology, the data transmission bandwidth between logic circuits and DRAM will exceed ten times the current HBM. The integration of logic and memory in the wafer-level system integration AI design and manufacturing service will significantly reduce the development threshold for AI chips.