Air-assisted Liquid Cooling Solution
As the power consumption of AI racks continues to surge, Foxconn has developed a complete line of rack-level liquid cooling solutions tailored to meet the cooling demands and sustainability goals of modern AI data centers. The liquid-to-air cooling solution is deployed adjacent to a IT rack, where heat is transferred through the liquid to a heat exchanger and subsequently dissipated into the air by large fans. Each cooling rack has a cooling capacity of up to 70kW, enabling data centers to achieve a PUE of 1.3 to 1.4. Moreover, with a monitoring management system, users can monitor critical parameters such as fan speed and water flow, to ensure the system operates normally and address any system abnormalities quickly.
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