ASIC Design Service
Application-Specific Integrated Circuits (ASIC) are chips designed and manufactured for specific applications. Unlike general-purpose processors that can perform various tasks, ASICs are optimized solutions tailored to meet specific functional requirements. Egis Technology's subsidiary, Alcor, offers professional ASIC design services, working closely with clients to thoroughly analyze application scenarios and needs. We provide precise planning and customization for chip functionality, performance indicators, power consumption constraints, and process node selection.
Alcor’s ASIC design services incorporate advanced packaging technologies, including CoWoS. Through thermal simulation, electrical simulation, and mechanical stress simulation, we ensure the efficiency and reliability of the designs, significantly improving product yield. The interposer size is smaller than 3.3 times the mask size, providing flexible design options, high performance, and low power consumption advantages. Additionally, a substrate core thickness of over 1000 microns enhances the mechanical strength of the packaging, reducing the risk of damage during manufacturing, assembly, and transportation.
Alcor has design service orders from leading consumer electronics brands in Japan and South Korea, with widespread applications in chips, wearable devices, and other areas.
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